TCK Series Touch Screen USB RF Wireless Thermal Profiler SMT Reflow Oven Temperature Profiler for Electronic Assembly PCB Profile Test Wave Soldering Temperature Recorder
Product Introduction
In modern electronics manufacturing and industrial curing processes, maintaining precise thermal profiles is critical to ensuring product reliability and solder joint integrity. The TCK Series Thermal Profiler is an advanced, high-precision temperature testing solution designed for both reflow and wave soldering processes. Capable of continuously testing up to 20 sets of temperature curves, this profiler combines robust hardware with intelligent analysis software to deliver accurate process window evaluation and curve optimization. Engineered for demanding factory environments, the TCK Series is your ultimate tool for achieving flawless thermal management.
Standard Composition
- Thermal profiler
- Insulation box
- Temperature test line
- Data download line
- Charger
- Hi-temp adhesive tape
- Software CD
- “+” screwdriver
- Tweezers
- Insulated gloves
- Solder wire
- Scissors
- Instrument box
- User Manual
- Acceptance Certificate
- RF Transceiver (Choose Composition)
- Wave Test System (Choose Composition)
Main Technical Specifications
- Thermocouple: K-type thermocouple
- Sampling interval:0.05sec---600sec Set with software
- Record data:80000 point/channel, Can record 20 sets profile
- Resolution: 0.1℃
- Temperature measuring range: 0—1000℃
- Temperature measuring accuracy: ±1.0℃
- Total power: ≤120mW
- Operating voltage:3.6VDC, rechargeable battery
- Dimensions: 195(L)×82(W)×21(H)mm 195(L)×103(W)×21(H)mm
- Insulation box:245(L)×100(W)×30(H)mm
- Start Mode : Manual, specified time or specified temperature
- Record mode: Monitor/Record
- Connection mode:USB/RF
- Software version:Profilermanager 2.0
Product Library Manager
Machine Library Manager
Solder Library Manager
Recipe Library Manager
Data analysis
PWI
Peak Temp,Times of overtop the Temp
Times of between Temp(Reflow)
Slope of between Temp(Reflow)
Slope of between Times(Wave)
Versatile Application Scenarios
The TCK Series Thermal Profiler is highly adaptable, serving critical roles across a wide spectrum of manufacturing industries:
- SMT/DIP Electronics Assembly: Essential for optimizing reflow oven and wave soldering temperature curves to prevent defects like cold solder joints or component thermal shock.
- Automotive & Appliance Coating: Precision temperature tracking for powder coating, non-stick paint, and automotive paint curing processes.
- Solar & Glass Manufacturing: Monitoring thermal profiles for solar panel lamination, glass tempering, and annealing processes.
- Industrial Curing & Heat Treatment: Accurate profiling for epoxy resin curing, UV paint baking, enamel sintering, and aluminum alloy heat treatment.
Why Choose Our TCK Series Thermal Profiler?
We understand that thermal profiling is the backbone of process quality control. The TCK Series stands out by combining industrial-grade durability with cutting-edge software analytics. Unlike basic data loggers, our profiler actively helps you optimize your process by providing actionable insights through PWI metrics and simulated curve adjustments. With a low power consumption design, long-lasting rechargeable battery, and comprehensive accessory kit (including high-temperature tape, tweezers, and insulated gloves), the TCK Series is engineered to maximize your operational efficiency and minimize process variability.
Ready to Perfect Your Thermal Process?
Don't let temperature variations compromise your product quality or yield. Upgrade to the precision and intelligence of the TCK Series Thermal Profiler. Contact us today for a customized quotation, software demonstrations, or to discuss your specific profiling requirements. Let our engineering team help you achieve the perfect thermal curve for your production line.
